ERSA IR500A PDF

A compact sized workplace with PCB holder and bottom side preheating for touch-up and other soldering jobs. With a total of 4 various tools, every rework, repair and soldering application can be handled. The BGA is here to stay! Five years ago the industry was not so sure about the staying power of this revolutionary component packaging design. Today, there is no longer any dispute. The only question remains: how can every operator conduct proper BGA rework in a process controlled and cost effective manner?

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A compact sized workplace with PCB holder and bottom side preheating for touch-up and other soldering jobs. With a total of 4 various tools, every rework, repair and soldering application can be handled. The BGA is here to stay! Five years ago the industry was not so sure about the staying power of this revolutionary component packaging design. Today, there is no longer any dispute.

The only question remains: how can every operator conduct proper BGA rework in a process controlled and cost effective manner?

User-friendly operation is the key to increasing productivity and achieving repeatable results. Second only to optimal process controlled performance, is operator ease of use that drove the engineering of the station. Every operator, in every shift, and with any skill level, should be capable of achieving the same results with speed, safety, and comfort.

A total semi-automatic PCB rework station for every workbench must be designed with size and flexibility in mind. The flexibility of this revolutionary, all inclusive system, is unparalleled in the industry by providing the tools for every soldering application imaginable.

A total solution priced for every operator, every workbench and every budget: the IR A does not only require any nozzles, it was specifically engineered with the price in mind.

Unlike the myriad of hot air systems on the market, which require a different nozzle for every different component, the use of dark IR radiators allows Ersa to greatly reduce operational costs.

The top IR radiator has a patented XY aperture system that negates the use of nozzles or templates. All sizes and shapes of components from 10 to 50mm in length can be rapidly and safely removed or installed without unnecessary overheating of adjacent components.

A simple setting of the XY aperture on the top IR radiator is all that is needed — no nozzles are required.

In contrast to hot air systems, the Ersa dark IR radiators guarantee uniform absorption, and even heating across the entire surface of the component and substrate. Uniform heating is essential for process controlled installations of BGAs. This can lead to overheating of the component body and substrate before reflow has been achieved at the leads. The component body, substrate, and leads are safely and evenly heated, reducing any risk of damage during the soldering or desoldering process.

Safety, ease-of-use, and repeatable results by all operators were the driving forces behind the Auto-IR-concept. The component to be removed is rapidly located with the help of a fixed axis laser positioning device, and is precisely positioned in the middle of the top and bottom IR radiators. A spring supported vacuum pipette, which is centered in the top IR radiator, is automatically placed on the center of the component. When reflow is achieved, the component is automatically lifted off the board, thereby reducing any risk of overheating — no contact, no fuss, no risk of damage.

The complete stand-alone system is designed for every rework application. No special training or additional items are required. The user-friendly station will assist step-by-step and ensure that all operators conduct process controlled rework in minutes:. Position K-type thermal couple rod on surface of PCB next to component digital display will indicate temperature ramp rate.

Component is automatically centered between top and bottom IR radiators. The majority of the BGA rework stations on the market use hot air to transfer heat through the component body to the solder balls, or try to blow hot air under the component. It is paramount, however, that the heat transfer medium air or gas be uniformly distributed across the entire surface of the BGA.

Air flow dynamics dictate that as hot air blows through the nozzle, it rotates or has a rifling effect that causes an increased heating pattern along the walls of the nozzle. This heating pattern is no, and physically cannot be, uniform. While such a heat transfer mechanism is marginally acceptable for a PQFP or external leaded device, it is completely unacceptable for BGAs.

The solder balls located in the center of the component inevitably receive insufficient heat. The top of the line rework stations, which have specially designed nozzles that blow hot air under the BGA, have the problem of overheating the leads close to the edge of the component before reflow can be achieved in the center.

This physical effect cannot be avoided. Temperature of the air flow is always higher, closer to the heating element. The Ersa dark IR radiators achieve a uniform heating across the entire surface of the BGA component, thereby approaching a reproduction of the machine reflow process. The unit is equipped with an RS serial port and the option to connect from 2 up to 32 thermal couples to the component body, substrate top or bottom side, or wherever desired.

The optional process control software can document precise thermal profiles of all soldering and desoldering operations for ISO procedures. Total flexibility means being able to handle any job in a safe and controlled manner. The IR A can replace practically every soldering tool, station, etc. The integration of the top-of-the-line soldering station Micro-Con 60 iA offers the expansion of the unit to include a total of 4 various tools to handle essentially every rework, repair and soldering application.

Specific soldering applications need specific soldering tools. Cleaning of pads requires a soldering or desoldering iron with special tips. Chip removal and replacement are most effectively accomplished with a light weight, high power thermal tweezing tool and the appropriate tips. Low temperature removal, replacement, and touch up with any of the optional tools are safe and easy. The bottom side dark IR radiator is the perfect preheat system for the most difficult of PCB substrates. The compact size provides an ideal workplace with integrated PCB holder and bottom side preheating for touch-up and any other hand soldering job.

From ultra-fine-pitch to high-mass aluminum housings, from temperature sensitive flex and polyamid substrate to the heaviest multilayer, from micro-chips, SMD and thru-hole sockets, to pin grid array and BGA, the IR A is the answer to total flexibility. Precise and flexible rework procedure. Continuous further development broadens the application spectrum. Vacuum conveyors. For industrial gas detection. Aktuelle Ausgabe. Jetzt unseren Newsletter abonnieren. Technisches Wissen aus erster Hand.

Hier finden Sie aktuelle Whitepaper. Hier finden Sie alle aktuellen Videos. Managementebene Leitung 3. Ich habe die AGB gelesen und bin einverstanden.

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Ersa IR500A

With the worlds largest range of machine and hand soldering equipment and over 75 years of industrial experience, ERSA is synonymous with expertise and quality. Our primary focus is not just to sell product but rather to solve application problems. Complete solutions mean not only an extensive product range, but also a firm committment to knowledge transfer and applicationsoriented custom solutions. ERSA offers over pages of tools, stations, tips, and accessories which either compliment the IR A or are designed to solve your specific soldering requirements. Please request a complete set of ERSA product catalogues in order to find your complete solution. User-friendly operation is the key to increasing productivity and achieving repeatable results.

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